3d Mapping Of Solid Contents
How it works
The 3DLevelScanner employs a 2-dimensional array beam-former to transmit low frequency pulses and to receive echoes of the pulses from the contents of the silo, bin or other container. The device's Digital Signal Processor samples and analyzes the received signals. From the estimated times of arrival and directions of received echoes, the processor obtains and generates a 3-dimensional image of the surface that can be displayed on a remote screen. This unique device can then accurately determine the volume and mass of material, enabling an unrivaled degree of process measurement and inventory control.
For more information, please visit:
https://edir.bulk-online.com/profile...-solutions.htm ■
3D Level Measurement for Bulk Solids
APM 3DLevelScanner at SCS 2008 in Paris, France
SCS 2008 brings together in one venue all the ELECTRICAL, AUTOMATION and MECHATRONICS solutions for industry, and meets the industry’s requirements with regard to design, development and optimization aiming at increased saving, efficiency and productivity.
At SCS 2008 from December 2-5, APM will show the 3DLevelScanner: an innovative, effective and economical non-contact 3D level measurement instruments for a range of industrial applications.
APM wishes to invite you to see live demonstration of the revolutionary 3DLevelScanner for bulk solid measurement. No more inaccurate calculations based on a single sample point, but a unique family of devices that generate 3-dimensional maps of the content of the silo/open bin/warehouse.
APM’s innovative technology is the best-of-class solution for accurate measurement of bulk solids, particularly those in dusty environments
For the first time in the solids industry 3DLevel measurement provides true and accurate measurement of volume and mass of silo contents – an achievement of critical importance especially in the chemical industry.
For more information, please visit:
https://edir.bulk-online.com/profile...-solutions.htm
Fig. 1: The 3DLevelScanner
Fig. 2: 3D Mapping of the surface area
Fig. 3: 3DLinkPro Communication Box with GSM Capabilities
Attachments
apm_1 (GIF)
apm_2 (GIF)
apm_3 (GIF)
■