Technical Consulting Services
Hi
Rapid thermal processing (or RTP) refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (up to 1200 C or greater) on a timescale of several seconds or less. The wafers must be brought down (temperature) slow enough however, so they do not break due to thermal shock..Such rapid heating rates are attained by high intensity lamps process. These processes are used for a wide variety of applications in semiconductor manufacturing including dopant activation, thermal oxidation, metal reflow and chemical vapor deposition.
Technical Consulting Services ■
Technical Consulting Services
Hi
Rapid thermal processing (or RTP) refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (up to 1200 C or greater) on a timescale of several seconds or less. The wafers must be brought down (temperature) slow enough however, so they do not break due to thermal shock..Such rapid heating rates are attained by high intensity lamps process. These processes are used for a wide variety of applications in semiconductor manufacturing including dopant activation, thermal oxidation, metal reflow and chemical vapor deposition.
Technical Consulting Services ■
Thermal Processing Products
Cylindrical Ceramic Honeycomb
Honeycomb ceramics of Hisina have large m2/m3, low air-flow resistance, it¡¯s bee widely used in catalyst carriers, active catalysis and air flow distributor, also utilized in heat exchange processes, catalytic converters exhaust gas, reducing carbon monoxide, smog etc.
•the carrier of activator¡ªreduce temperature of organic materials been oxidated, purge waste gas such as industry and car
•the medium of exchange temperature¡ªused for the process of temperature exchange, saving energy 12%
•the carrier of solid animal¡ªused for pharmacy and food industry
•the instrument for resistance to fire¡ªsmall kg/m3, fast way to transfer hot
•make the burning of coal gas equality, can save energy 10%
Material
And Item AL2O3
(%)Hole typeMillihole
(µm)Coefficient of thermal expansion
(*10-6/¡æ)Refractoriness
(¡æ)Normal temperature
Pressure
(MPa)
Cordierite37Optional2-3¡Ü1.81390¡12
Mullite46Optional2-3¡Ü4.01550¡15
Alundum mullite70Optional2-3¡Ü5.51700¡15
The shape and size be designed by customer¡¯s request
Carrie
Hisina Industrial Co.,Ltd.
Pingxiang Economic Development Zone of Jiangxi 337000, China
www.hisina.com
Tel:+86 799 661 1866
Fax:+86 799 661 1906
Cell:+86 150 799 56978
Attachments
060111001 (JPG)
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